No two QA applications are the same - flexibly focusing on customer requirements

Based on this principle, the modular Solarius AOP systems offer extensive possibilities for individualizing metrological solutions in quality assurance. Solarius AOP systems allow full customization of 3D measurement technology, as well as inspection and data analysis to customer-specific applications and production process conditions.

The AOP product line utilizes the full range of available 2D and 3D optical sensor technologies based on state-of-the-art intelligent system software. Optionally, we use point and line triangulation, confocal point, line and area sensors, different types of interferometers and the latest hybrid 3D technologies.


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Particle Inspection

Particle inspection is most important when stacking functional devices, avoiding piercing of critical layers. Particles are separated from undeneath surfaces and become measured in diameter, height and distribution. Contributing highest resolution the Solarius Polaris tools quickly detect even smallest particles.

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Bulk Thickness

Hight-tech devices which are manufactured by stacking of components, such as fuel cells, 3D wafer lavel packages and interposers require very tight thickness tolerance and lowest possible total thickness variation (TTV). Both parameters can reliably be detected using the specialized Solarius AOP Thickness systems.

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Bump Inspection

While wire bonding stays a method of choice for heavy duty connections in semicondutors, ball grid arrays (BGAs) are indispensable for 1st and 2nd level interconnects since many years. The arrays are tested for planarity, diameter uniformity, misplacement and missing items by the specialzed SEMI BGA inspection tool.


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Branch Office Europe

Albrechtstr. 43
80636 München